CVE-2021-30350 HIGH

CVE-2021-30350

Vendor Qualcomm, Inc.
Product Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Published June 14, 2022
Last update August 3, 2024
View on NVD All CVEs

CVSS base score

8.4/10
Attack vector Local
Attack complexity Low
Privileges required None
User interaction None
Confidentiality High
Integrity High

CVSS vector

CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

What the vulnerability does

01Description

Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables

Key dates

02Disclosure timeline

June 14, 2022 CVE published
August 3, 2024 Record updated