CVE-2022-33217 HIGH

CVE-2022-33217

Vendor Qualcomm, Inc.
Product Snapdragon Mobile
Published October 17, 2022
Last update May 14, 2025
View on NVD All CVEs

CVSS base score

7.8/10
Attack vector Local
Attack complexity Low
Privileges required Low
User interaction None
Confidentiality High
Integrity High

CVSS vector

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

What the vulnerability does

01Description

Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile

Key dates

02Disclosure timeline

October 17, 2022 CVE published
May 14, 2025 Record updated